深圳厚积电子有限公司

RoHS Compliant OptionalBitmap FEATUREXO/XI■XO Typical 11.1*4.68*2.5 mm standard footprint.■XL Typical 11.1*4.68*3.51 mm standard footprint.■Low cost.■Low profile for close PCB stacking.■Aging:±5ppm/year.■Packing:Plastic bag 200/500 pcs or Ammopack 1000 pcs(800 pcs).XP/XJ■XP Typical 13.0*4.85*3.15 mm metal can SMD package.■XJ Typical 13.0*4.85*4.2 mm metal can SMD pcakage.■24mm width Tape & Reel package for automatic assembly.■Aging:±5ppm/year.■Packing:Tape & Reel，standard 1000 pcs per Reel.EQULVALENT SERLES RESISTANCE(ESR)ELECTRICAL SPECIFICATION  TYPE FREQUENCYMODEE.S.RStorage Temp.Range-55℃～125℃Freq.≦4MHzA1140ΩDrive Level10μW typical4MHz﹤Freq.﹤5MHzA1120ΩShunt Capacitance(Co)7.0pF Max.5MHz≦Freq.﹤6MHzA180ΩInsulation Resistance500MΩ Min.@ DC 100V6MHz≦Freq.﹤7MHzA170ΩAgingFirst year±5ppm
Sub-year±5ppm7MHz≦Freq.﹤9MHzA145Ω9MHz≦Freq.﹤13MHzA140Ω13MHz≦Freq.﹤16MHzA135Ω16MHz≦Freq.﹤20MHzA130Ω20.00MHz≦Freq.≦24MHzA125Ω24MHz≦Freq.﹤32MHzA3120Ω32MHz≦Freq.≦80MHzA380ΩA1:AT cut fundamentalA3:AT Third OvertoneFREQ.STABILITY vs.LOAD CAPACITANCEFREQ.STABILITY vs.TEMP.RANGE  Load Capacitance                  ppm              A:±5B:±10P:±15C:±20E:±30Temp.(℃)                ppmA:±5B:±10P:±15C:±20A8pF××△○○I-10 to +60×○○○C10pF××△○○C-20 to +70×△○○D12pF×△○○○L-40 to +85×××○F16pF×△○○○○:Standard △:Available(case by case) ×:Not availableSSeries△○○○○○:Standard △:Available(case by case) ×:Not available