Indium8.9HF1/88.25%/SAC305/TYPE4

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[供应]Indium8.9HF1/88.25/SAC305/TYPE4

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更新日期：2024-04-28 10:27:02
有效期至：2025-04-28
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Indium8.9HF1/88.25/SAC305/TYPE4 详细信息

Introduction

Indium8.9HF-1isanairreflow，no-cleansolderpaste.Indium8.9HF-1offersunprecedentedstencilprinttransferefficiencytoworkinthebroadestrangeofprocesses.Inaddition，thehighprobetestabilityofIndium8.9HF-1minimizesfalsefailuresinICT.

Alloys

IndiumCorporationmanufactureslow-oxidesphericalpowdercomposedofavarietyofPb-freealloysthatcoverabroadrangeofmeltingtemperatures.ThisdocumentcoversType4andType3powderasstandardofferingswithSACalloys.Themetalpercentistheweightpercentofthesolderpowderinthesolderpasteandisdependentuponthepowdertypeandapplication.Standardproductofferingsaredetailedinthefollowingtable.

Features

?HighoxidationbarriertoeliminategrapingandHIPdefects

?Highlyprobetestablefluxresidue

?Halogen-freeperEN14582testmethod

?Excellentprinttransferefficiencyon0.4mmpitchCSPs

CompatibleProducts

?ReworkFlux:TACFlux?089HF，TACFlux?020B

?CoredWire:CW-807

?WaveFlux:WF-9945，WF-9958

Note:Otherproductsmaybeapplicable.PleaseconsultoneofIndiumCorporation’sTechnicalSupportEngineers.

Cleaning

Indium8.9HF-1isdesignedforno-cleanapplications，howeverthefluxcanberemovedifnecessarybyusingacommerciallyavailablefluxresidueremover.

StencilCleaningisbestperformedusingisopropylalcohol(IPA)asasolvent.Mostcommerciallyavailablenon-water-basedstencilcleanersworkwell.

Printing

StencilDesign:

Electroformedandlasercut/electropolishedstencilsproducethebestprintingcharacteristicsamongstenciltypes.Stencilaperturedesignisacrucialstepinoptimizingtheprintprocess.Thefollowingareafewgeneralrecommendations:

?Discretecomponents—A10-20%reductionofstencilaperturehassignificantlyreducedoreliminatedtheoccurrenceofmid-chipsolderbeads.The“homeplate”designisacommonmethodforachievingthisreduction.

?Finepitchcomponents—Asurfaceareareductionisrecommendedforaperturesof20milpitchandfiner.Thisreductionwillhelpminimizesolderballingandbridgingthatcanleadtoelectricalshorts.Theamountofreductionnecessaryisprocessdependent(5-15%iscommon).

?Foroptimumtransferefficiencyandreleaseofthesolderpastefromthestencilapertures，industrystandardapertureandaspectratiosshouldbeadheredto.

苏州贝俊轮商贸有限公司发布与 Indium8.9HF1/88.25/SAC305/TYPE4 相关的产品
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