哈尔滨特博科技有限公司

2英寸蓝宝石切割片

2英寸蓝宝石研磨片
2英寸蓝宝石清洗封装片

单晶晶体质量指标：

蓝宝石晶体纯度≥99.996%
蓝宝石晶体内没有散射颗粒、气泡、无颜色、无包裹物、无多晶、无孪生等现象；蓝宝石晶体无小角晶，晶体定向精度小于0.1°

产品规格：

Epi-Ready Sapphire Wafer

Diameter

50.8±0.1mm

Thickness

430±10μm

Orientation

C-plane 0.2°to M-axis ± 0.1°

C-plane 0°to A-axis ± 0.1°

Orientation flat

16.0±1mm

Primary flat location

A-axis ± 0.2°

Front side surface

Epi-Ready Polished

Surface Roughness

Ra＜0.2nm

Back side surface

0.8—1.2μ

TTV

＜10μ

BOW

＜10μ

Package

Clean Room，Nitrogen Atmosphere

研 磨 片

Orientation

C-plane 0.2°to M-axis ±0.1°

C-plane 0°to A-axis ± 0.1°

Diameter

50.8 ± 0.1mm

Thickness

0.49 ± 0.05mm

TTV

15um

Warp

15um

Primary Flat

Length

16.0±1.0mm

Orientation

A-plane±0.2°

Visual appearance

No cracks，pits，edge chipping