1. 单组份导电银胶one-component conductive silver glue
单一组分,优异的导电性、韧性以及粘结强度,贮存稳定性好,贮存期长,成型工艺:150℃,60min。成型后干膜体积电阻率≤5×10-4Ω?cm。长期使用温度100℃左右,适用于多种电子元器件间的粘结。
single component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: 150 ℃, 60min. volume resistivity of curing film ≤ 5 × 10-4Ω ? cm. Long-term working temperature is about 100 ℃, suitable for the bonding between a variety of electronic components.
2. 双组份导电银胶two-component conductive silver glue
A/B组分,优异的导电性、韧性以及粘结强度,贮存稳定性好,贮存期长,成型工艺:室温,24h或者室温,30min+130℃,60min(成型工艺可根据用户要求现设计),体积电阻率≤5×10-4Ω?cm,粘结强度优异,适合低温工作环境。
A/B component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: room temperature,24h or room temperature,30min+ 130 ℃, 60min(forming process can be designed according to users’ requirements ) . volume resistivity of curing film ≤ 5 × 10-4Ω ? cm. excellent bonding strength, suitable for low temperature working environment .
3. 耐高温导电银胶high temperature conductive silver glue
单一组分,长期耐温≤250℃,具有优异的导电性以及粘结强度,对大多数材料的粘结强度高,特别是对金属材料的粘结力好,施工性好,主要用于长期高温环境下使用的电子元器件的粘结,贮存期长。
Single component, long-term working temperature ≤ 250 ℃, excellent conductivity and bonding strength, high bonding strength with most materials especially metallic materials, good construction, mainly used for bonding between electronic components in long-term high temperature environment, long storage time.